This type of Copper is used for acid Copper plating, where anodes are with a minimum of 400 ppm of phosphorus.
The role of phosphorus is to bind copper and make sure the anode releases copper ions as required by the cathode.
This type of Copper is used for non-acidic and alkaline copper plating, where anodes are with less than 10ppm of oxygen.
The role of Oxygen-free copper is to avoid anode polarization and ductility in cathodic material.
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